Synthesis of Boron Nanocomposites Doped on the Hydroxyapatite-Chitosan Surface and Its Effect on the Microhardness of Demineralized Tooth Enamel

Background and Objective: Noninvasive treatments are preferred for tooth enamel remineralization, and metal nanocomposites could be used for this purpose. The present study investigated the effect of boron nanocomposites doped on the hydroxyapatite-chitosan surface on the microhardness of demineralized tooth enamel. Materials and Methods: In this laboratory study, boron nanocomposites doped on the hydroxyapatite-chitosan surface were made by the sol-gel method. A total of 45 healthy human teeth were selected and divided into buccal and lingual halves. The demineralization cycle of the samples was performed for 14 days to demineralize the tooth enamel surface. The samples were randomly divided into three equal groups based on the use of remineralizing materials, G1:hydroxyapatite-chitosan nanocomposites; G2:boron nanocomposites doped on the hydroxyapatite-chitosan surface, and G3:control group without nanocomposite. Nanocomposites were applied on the surface of the teeth for 28 days (twice a day). The microhardness of the samples was performed by the Vickers test at three points. The SPSS software (version 19), one-way analysis of variance, and Tukey's test were used for statistical analysis of the data (α=0.05). The surface morphology of the groups was examined by SEM[A1] . Results: There was a statistically significant difference between the three studied groups (P<0.001). The highest mean was first observed in the G2(368.12) and then in the G1(342.62). Moreover, the lowest mean was related to the control group(267.53). Pair-by-pair comparison of groups showed that there was a significant statistical difference between groups 1 and 2, 1 and 3 as well as 2 and 3 (P<0.05). Conclusion: Both HApC and B@HApC compounds improve remineralization and increase the microhardness of tooth enamel; however, this increase was greater in the presence of a boron-containing compound.  [A1]Please expand.